Silicon Nitride Grinding Ball Manufacturers, Suppliers ...
Thermal Conductivity. 16-22W/mk. Hardness(HRA) ≥92. Coefficient of Thermal Expansion. 3.2-3.4 10-6K. Flexural Strength. ≥600Mpa. Working Temperature. 1400℃ Density g/cm 3. Relative density % Elastic modulus Gpa. Compression strength ration. Hardness Gpa. 3.26±0.02 >99.5. 300-320. 40-50. 14-18. Fracture toughness. Bending strength. Poisson’s ratio. Linear expansion coefficient
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